Wafer level package with die receiving through-hole and method of the same
AssigneeAdvanced Chip Engineering Technology Inc.
InventorWen-Kun Yang
Life of this patent
Estimating the term…
Abstract
The present invention discloses a structure of package comprising: a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad; a die disposed within the die receiving through hole; a surrounding material formed under the die and filled in the gap between the die and sidewall of the die receiving though hole; a dielectric layer formed on the die and the substrate; a re-distribution layer (RDL) formed on the dielectric layer and coupled to the first contact pad; a protection layer formed over the RDL; and a second contact pad formed at the lower surface of the substrate and under the connecting through hole structure.
Claims17
A structure of semiconductor device package comprising:
- a substrate with a die receiving through hole, a connecting through hole structure and a first contact pad;
- a die disposed within said die receiving through hole;
- a surrounding material formed under said die and filled in the gap between said die and sidewall of said die receiving though hole;
- a dielectric layer formed on said die and said substrate;
- a re-distribution layer (RDL) formed on said dielectric layer and coupled bonding pads of said die to said first contact pad;
- a protection layer formed over said RDL;
- and
- a second contact pad formed at the lower surface of said substrate and under said connecting through hole structure.
A method for forming semiconductor device package comprising:
- providing a substrate with die receiving through holes, connecting through hole structure and contact metal pads;
- printing patterned glues on a die redistribution tool;
- redistributing desired dice on said die redistribution tool with desired pitch by a pick and place fine alignment system;
- bonding said substrate to said die redistribution tool;
- refilling elastic core paste material into the space between said dice and sidewall of the through hole and back side of said dice;
- bonding glass carrier on the back side of panel;
- separating said die redistribution tool;
- coating a dielectric layer on the active surface of said die and upper surface of said substrate;
- forming openings to expose contact pads of said dice and substrate;
- forming at least one conductive built up layer over said dielectric layer;
- forming a contacting structure over said at least one conductive built up layer;
- forming a protection layer over said at least one conductive built up layer.
Dependencies are inferred from the claim text.