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US 2008/0157335 A1Published application
Strip patterned transmission line
OwnerJia Miao Tang, Xiang Yin Zeng +2inventors
InventorsJia Miao Tang, Xiang Yin Zeng, Dao Qiang Lu, Jiang Qi He
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Abstract
A semiconductor package has a substrate. The substrate comprises a set of interconnects. An dielectric material may be provided under one or more of the interconnects to adjust the impedance of transmission line.
Claims21
A semiconductor package, comprising:
- a substrate having one or more interconnects;
- and
- a first dielectric material provided under one or more of the interconnects.
A method, comprising:
- providing one or more interconnects on a substrate, and
- providing a first dielectric material in the substrate, wherein the first dielectric material is provided under one or more of the interconnects.
A computer system, comprising:
- a substrate,
- a first control coupled to the substrate, and
- a second control coupled to the first control by a first interconnect on the substrate, wherein a first dielectric material is provided under the first interconnect.
Dependencies are inferred from the claim text.