Memory module for improving impact resistance
AssigneePowertech Technology Inc.
InventorWen-Jeng Fan
Life of this patent
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Abstract
A memory module for improving impact resistance mainly comprises a multi-layer PWB (Printed Wiring Board) and a plurality of memory packages. The multi-layer PWB is rectangular and has two longer sides and two shorter sides, wherein a plurality of gold fingers are disposed along one of the longer sides, at least an arc notch and a plurality of first stress-absorbing slots are formed at the two shorter sides respectively. Preferably, plural second stress-absorbing slots are formed at another longer side far away from the gold fingers. The impact stress due to accidental drop may be absorbed by the first stress-absorbing slots or/and the second stress-absorbing slots to prevent the product from damaging.
Claims11
A memory module comprising:
- a multi-layer PWB (printed wiring board) in rectangular shape having two longer sides and two shorter sides, the PWB having a plurality of gold fingers disposed along one of the linger sides, at least an arc notch disposed at each shorter side respectively, and a plurality of first stress-absorbing slots extending along and adjacent to the two shorter sides;
- and
- a plurality of memory packages mounted onto the PWB.
Dependencies are inferred from the claim text.