Chip package and manufacturing method thereof

A manufacturing method of a chip package, comprising:

• providing a patterned metal plate having at least a heat dissipation portion, a plurality of contacting portions, and a plurality of recesses, wherein the recesses separate the heat dissipation portion from the contacting portions, and the heat dissipation portion is disposed among the contacting portions;
• forming a conductive adhesive layer on the contacting portions;
• bonding the patterned metal plate to a film-like circuit layer, wherein the film-like circuit layer is electrically connected to the contacting portions through the conductive adhesive layer;
• disposing at least a chip on the film-like circuit layer, wherein the chip has a plurality of bumps, and the chip and the film-like circuit layer are electrically connected through the bumps;
• forming a first molding on the patterned metal plate to encapsulate at least a portion of the film-like circuit layer, wherein the first molding fills the recesses;
• removing a portion of the patterned metal plate to expose the first molding in the recesses and to form at least a thermal enhanced plate and a plurality of contacts separated therefrom;
• and
• performing a cutting process to form at least a chip package.

A manufacturing method of a chip package, comprising:

• bonding a patterned metal plate to a substrate, wherein the patterned metal plate comprises at least a thermal enhanced plate and a plurality of contacts around the thermal enhanced plate;
• forming a conductive adhesive layer on the contacts;
• bonding the patterned metal plate to a film-like circuit layer, wherein the film-like circuit layer is electrically connected to the contacts through the conductive adhesive layer;
• disposing at least a chip on the film-like circuit layer, wherein the chip has a plurality of bumps, and the chip and the film-like circuit layer are electrically connected through the bumps;
• forming a first molding on the patterned metal plate to encapsulate at least a portion of the film-like circuit layer, a portion of the thermal enhanced plate and parts of the contacts;
• removing the substrate;
• and
• performing a cutting process to form at least a chip package.