Semiconductor Device with Chip Mounted on a Substrate

A semiconductor component comprising:

• a plurality of semiconductor devices, each semiconductor device comprising:
• a chip having an active side and a rear side and also having lateral faces and having chip contacts on the active side;
• a substrate having a first side and a second side, wherein the chip is arranged over the first side of the substrate and at least partially overlies the first side, the substrate having contacts arranged on the second side, the contacts being electrically connected to the chip contacts, wherein the contacts arranged on the second side of the substrate comprise external contacts for making electrical contact with the semiconductor device, the external contacts being electrically connected to the chip contacts;
• and
• a cover connected to the substrate, wherein the cover and the substrate encapsulate the chip on all sides, the chip being fixed in position within a pocket formed by the connected cover and the substrate,
• wherein
• the substrate and the cover of each semiconductor device of the plurality of semiconductor devices comprise the same material,
• the semiconductor devices are stacked one above another, and
• the external contacts of at least one semiconductor device are electrically connected to external contacts of the semiconductor component by means of interconnections and vias.

A component for mounting chips in a semiconductor device or a semiconductor package, the component comprising:

• a frame;
• a base connected to the frame;
• and
• a pocket for a chip to be accommodated, the pocket formed from a first opening in the frame which ends on the base, the pocket having a height, a size and a shape that are at least as great as a height, a size and a shape of the chip to be accommodated.

A semiconductor package including at least two chips, the semiconductor package comprising:

• a first chip having an active side and a rear side and side faces, the first chip including chip contacts on the active side;
• a second chip having an active side and a rear side and side faces, the second chip including chip contacts on the active side;
• a first component comprising a first frame, a first base connected to the first frame, and a first pocket formed from a first opening in the first frame which ends on the first base, the first chip being fixed in position in the first pocket of the first component, the active side of the first chip facing the first base of the first component, and the chip contacts of the first chip being electrically connected with first contact pads of the first base of the first component;
• a second component comprising a second frame, a second base connected to the second frame, and a second pocket formed from a first opening in the second frame which ends on the second base, the second chip being fixed in position in the second pocket of the second component, the active side of the second chip facing the second base of the second component, the chip contacts of the second chip being electrically connected with second contact pads of the second base of the second component, wherein the second component is stacked above the first component in such a way that the first base of the first component is joined to the second frame of the second component;
• and
• a cover joined to the first frame of the first component and closing off the first pocket of the first component.