Electronic component contained substrate
AssigneeShinko Electric Industries Co., Ltd.
InventorAkinobu INOUE
Life of this patent
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Abstract
In an electronic component contained substrate in which electronic components are mounted between a pair of wiring substrates in a plural-stage stacked fashion, one wiring substrate and other wiring substrate are connected electrically mutually via solder balls, a first electronic component is mounted on one wiring substrate and then a second electronic component is mounted on the first electronic component, an opening portion for containing the second electronic component therein is provided in the other wiring substrate, the second electronic component is contained and mounted in the opening portion and is connected electrically to the other wiring substrate by a wire bonding, and a space between the pair of wiring substrates is sealed with a sealing resin.
Claims6
An electronic component contained substrate comprising:
- a pair of wiring substrates;
- a plurality of electronic components which are mounted between the pair of wiring substrates in a stacked fashion, the electronic components including a first electronic component mounted on one wiring substrate and a second electronic component mounted on the first electronic component;
- a solder balls which electrically connects the pair of wiring substrates;
- and
- a sealing resin which seals a space between the pair of wiring substrates,
- wherein the other wiring substrate has an opening portion for containing the second electronic component therein, and
- wherein the second electronic component is mounted so that the second electronic component is contained in the opening portion of the other wiring substrate and is connected electrically to the other wiring substrate by a wire bonding.
Dependencies are inferred from the claim text.