Ic package and method of manufacturing the same

A method of manufacturing an IC package, comprising:

• mounting a first BGA IC package having a plurality of first solder balls on a printed circuit board;
• mounting an interposer having a plurality of through-holes on the first BGA IC package;
• mounting a second BGA IC package having a plurality of second solder balls on the interposer;
• and
• passing the printed circuit board, the first BGA IC package, the interposer, and the second BGA IC package through a heating furnace to melt the solder balls of the first BGA IC package such that the first BGA IC package is joined to the printed circuit board and to melt the solder balls of the second BGA IC package such that the through-holes of the interposer are filled with the solder balls of the second BGA IC package, whereby the second BGA IC package becomes joined to the first BGA IC package.

An IC package comprising:

• a printed circuit board;
• at least two BGA IC packages stacked on each other and each having a plurality of solder balls, the at least two BGA IC packages being stacked on the printed circuit board at the lower most package;
• and
• an interposer disposed between each of the at least two BGA IC packages and having a plurality of through-holes filled by the solder balls of the BGA IC package there above in a molten state such that the length of the solder balls increases while the solder balls harden, each interposer being joined to a top surface of one of the at least two BGA IC packages.

A method of manufacturing an IC package, comprising:

• mounting a first BGA IC package having a plurality of first solder balls on a printed circuit board;
• stacking at least one additional BGA IC package having a plurality of solder balls consecutively on the first BGA IC package;
• placing an interposer having a plurality of through-holes between each pair of the stacked BGA IC packages;
• and
• passing the printed circuit board, the BGA IC packages and the interposer through a heating furnace to melt the solder balls of each of the BGA IC packages such that the first BGA IC package is joined to the printed circuit board and to melt the solder balls of the other BGA IC packages such that the through-holes of the interposer are filled with the solder balls of the BGA IC package there above, whereby each pair of BGA IC packages become joined together.

A method of manufacturing an IC package, comprising:

• stacking plural BGA IC packages, each having a plurality of solder balls, above one another;
• placing an interposer having a plurality of through-holes therein between each of the BGA IC packages such that the through-holes align with the solder balls above the through-holes;
• and
• passing the BGA IC packages and the respective interposers through a heating furnace to melt the solder balls of each of the BGA IC packages such that the solder balls of the BGA IC package above each interposer melts through the through-holes and are brought into contact with circuit patterns of the BGC IC package below the respective interposer such that each pair of BGA IC packages become joined together.