Integrated circuit package with molded cavity

An integrated circuit package system comprising:

• providing a base substrate having base inner connections and base outer connections;
• mounting a base die over the base inner connections;
• mounting an integrated interposer having interposer circuit devices, interposer inner
• connections, and interposer outer connections, over the base die;
• connecting the base die electrically by a base package connector to the integrated
• interposer on the same side as the base die;
• molding a package system encapsulant having an encapsulant cavity exposing at least
• a portion of the interposer outer connections on a side opposite the base die;
• and
• mounting a top package over the interposer outer connections on the side opposite the base die.

An integrated circuit package system comprising:

• a base substrate;
• a base die over the base substrate;
• an integrated interposer having interposer circuit devices, over the base die;
• a package system encapsulant having an encapsulant cavity over the integrated interposer on a side opposite the base die.