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US 2008/0157324 A1Published application
Stacked die package with die interconnects
OwnerJia Miao Tang, Xiang Yin Zeng +2inventors
InventorsJia Miao Tang, Xiang Yin Zeng, Dao Qiang Lu, Jiang Qi He
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Abstract
A method of forming a package, comprising providing a set of dies on a substrate. The dies may be stacked on the substrate and may be coupled to the substrate by an interconnect provided on a side surface of the stacked dies.
Claims22
A method, comprising:
- providing a substrate having a lower die, and
- providing an die interconnect that extends on a side surface of the lower die to couple the lower die to the substrate.
A package, comprising:
- a substrate having a lower die;
- a die interconnect attached to a side surface of the lower die, wherein the die interconnect is coupled to the lower die.
A memory system, comprising:
- a substrate,
- a set of memory devices stacked on the substrate, and
- a die interconnect provided on a side surface of the memory devices to couple the memory devices to the substrate.
Dependencies are inferred from the claim text.