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US 2008/0157322 A1Published application
Double side stacked die package
OwnerJia Miao Tang, Xiang Yin Zeng +2inventors
InventorsJia Miao Tang, Xiang Yin Zeng, Daoqiang Lu, Jiangqi He
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Abstract
A method of forming a package, comprising providing a set of dies on a substrate. The substrate may have a first die on its upper side and a second die on its lower side. A first interconnect may be provided in the substrate, wherein the first interconnect penetrates through the substrate to couple the dies to the substrate.
Claims25
A semiconductor package, comprising:
- a substrate comprising a first die on its upper side and a second die on its lower side,
- a first interconnect provided in the substrate, wherein the first interconnect is to reach the upper side and the lower side to couple the first die and the second die to the substrate.
A method, comprising:
- providing a substrate having a first die on its upper side and a second die on its lower side,
- providing a first interconnect in the substrate, wherein the first interconnect penetrates through the substrate to couple the dies to the substrate.
A memory system, comprising:
- a substrate,
- a set of memory devices, wherein each memory device is provided on the substrate, and
- a first interconnect provided in the substrate, wherein the first interconnect is to reach an upper side and a lower side to couple the substrate and a memory device that is attached to each of the upper and lower sides.
Dependencies are inferred from the claim text.