Laterally Interconnected IC Packages and Methods
OwnerRay D. Harrison, Jianbai Zhu +2inventors
InventorsRay D. Harrison, Jianbai Zhu, Jeffrey J. Wolfe, Frank Stepniak
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Abstract
Semiconductor devices and methods for their assembly are described in which IC packages may be combined in novel configurations. A multi-package semiconductor device system and associated methods for its construction include a plurality of packaged semiconductor devices, each provided with at least one lateral electrical contact. The plurality of packaged semiconductor devices so provided are fixed in a coplanar configuration and have the adjacent lateral contacts coupled for operation in concert.
Claims18
A multi-package semiconductor device system comprising:
- a first packaged semiconductor device having at least one lateral electrical contact;
- a second packaged semiconductor device having at least one lateral electrical contact;
- wherein, the first packaged semiconductor device and the second packaged semiconductor device are fixed in a coplanar configuration;
- and wherein,
- at least one lateral electrical contact of the first packaged semiconductor device is coupled to least one lateral electrical contact of the second packaged semiconductor device for operation in concert.
A method for manufacturing a multi-package semiconductor assembly comprising the steps of:
- providing a plurality of packaged semiconductor devices, each of the semiconductor devices having at least one electrical contact adapted for lateral coupling;
- using the electrical contacts adapted for lateral coupling, operably coupling at least two of the packaged semiconductor devices, thereby forming a multi-package laterally interconnected semiconductor assembly suitable for operation in concert.
Dependencies are inferred from the claim text.