Mountable integrated circuit package-in-package system with adhesive spacing structures
AssigneeSTATS ChipPAC, Ltd.
InventorsJong-Woo Ha, SeongMin Lee, JoHyun Bae
Life of this patent
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Abstract
A mountable integrated circuit package-in-package system is provided including mounting an adhesion spacer over an integrated circuit die and a package substrate, mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer, and forming a package encapsulation for covering the integrated circuit package system over the adhesion spacer.
Claims20
A mountable integrated circuit package-in-package system comprising:
- mounting an adhesion spacer over an integrated circuit die and a package substrate;
- mounting an integrated circuit package system having an inner adhesion structure with the inner adhesion structure on the adhesion spacer;
- and
- forming a package encapsulation for covering the integrated circuit package system over the adhesion spacer.
A mountable integrated circuit package-in-package system comprising:
- mounting an integrated circuit die over a package substrate;
- mounting an adhesion spacer over the integrated circuit die;
- forming an integrated circuit package system having a prepackaged integrated circuit die, an inner encapsulation, and an inner adhesion structure exposed from the inner encapsulation;
- mounting the integrated circuit package system over the adhesion spacer with the inner adhesion structure on the adhesion spacer;
- and
- forming a package encapsulation having an opening for covering the adhesion spacer and the integrated circuit die with the opening partially exposing the integrated circuit package system over the package substrate.
A mountable integrated circuit package-in-package system comprising:
- a package substrate;
- an integrated circuit die over the package substrate;
- an adhesion spacer over the integrated circuit die;
- an inner adhesion structure;
- an integrated circuit package system having the inner adhesion structure, the inner adhesion structure on the adhesion spacer;
- and
- a package encapsulation for covering the integrated circuit package system over the adhesion spacer.
Dependencies are inferred from the claim text.