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US 2008/0157318 A1Published application
Bridge stack integrated circuit package-on-package system
AssigneeSTATS ChipPAC, Ltd.
InventorsSeng Guan Chow, Il Kwon Shim, Byung Joon Han
Life of this patent
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Abstract
A bridge stack integrated circuit package-on-package system is provided including forming a first integrated circuit package system having a first substrate, forming a second integrated circuit package system having a second substrate, and mounting a bridge integrated circuit package system on the first substrate and on the second substrate.
Claims20
A bridge stack integrated circuit package-on-package system comprising:
- forming a first integrated circuit package system having a first substrate;
- forming a second integrated circuit package system having a second substrate;
- and
- mounting a bridge integrated circuit package system on the first substrate and on the second substrate.
1 more element
A bridge stack integrated circuit package-on-package system comprising:
- forming a first integrated circuit package system having a first integrated circuit die over a first substrate;
- forming a second integrated circuit package system having a second integrated circuit die over a second substrate;
- forming a bridge integrated circuit package system having a bridge interconnect;
- and
- mounting the bridge integrated circuit package system on the first substrate and on the second substrate.
2 more elements
A bridge stack integrated circuit package-on-package system comprising:
- a first integrated circuit package system having a first substrate;
- a second integrated circuit package system having a second substrate;
- and
- a bridge integrated circuit package system on the first substrate and on the second substrate.
1 more element
Dependencies are inferred from the claim text.