High capacity memory module using flexible substrate

Abstract

A memory module includes a module substrate and a plurality of package units mounted to the module substrate such that they partially overlap each other. Each package unit has at least one memory semiconductor package attached thereto. Each package unit includes a flexible substrate, which has outer terminals provided over a lower surface adjacent to one edge thereof to form electrical connections with the module substrate, and the memory semiconductor package attached to one surface or each of both upper and lower surfaces of the flexible substrate.

Dependencies are inferred from the claim text.