Package structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsBenson Liu, Hsien-Wei Chen, Shin-Puu Jeng, Hao-Yi Tsai
Life of this patent
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Abstract
A package structure includes a substrate, a first die and at least one second die. The substrate includes a first pair of parallel edges and a second pair of parallel edges. The first die is mounted over the substrate. The first die includes a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively. The at least one second die is mounted over the first die.
Claims18
A package structure, comprising:
- a substrate comprising a first pair of parallel edges and a second pair of parallel edges;
- a first die mounted over the substrate, the first die comprising a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively;
- and
- at least one second die mounted over the first die.
A package structure, comprising:
- a substrate comprising a first pair of parallel edges and a second pair of parallel edges, wherein the substrate comprises at least one corner region and at least one central region;
- and
- at least one first die mounted at the central region of the substrate, the first die comprising a third pair of parallel edges and a fourth pair of parallel edges;
- and
- at least one second die mounted at the corner region of the substrate, the second die comprising a fifth pair of parallel edges and a sixth pair of parallel edges, wherein the fifth pair of parallel edges and the sixth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively.
A package structure, comprising:
- a substrate;
- at least one first die mounted over the substrate, the first die comprising a first pair of parallel edges and a second pair of parallel edges;
- and
- at least one second die mounted over the first die, the second die comprising a third pair of parallel edges and a fourth pair of parallel edges, wherein the third pair of parallel edges and the fourth pair of parallel edges are not parallel to the first pair of parallel edges and the second pair of parallel edges, respectively.
Dependencies are inferred from the claim text.