Semiconductor image device package with die receiving through-hole and method of the same

A method for forming semiconductor device package comprising:

• providing a substrate with die receiving through holes, connecting through hole structure and contact metal pads;
• printing patterned glues on a die redistribution tool;
• redistributing desired dice having micro lens area on said die redistribution tool with desired pitch by a pick and place fine alignment system;
• bonding said substrate to said die redistribution tool;
• refilling elastic core paste material into the space between said dice and sidewall of the through hole and back side of said dice;
• separating said die redistribution tool;
• coating a dielectric layer on the active surface of said die and upper surface of said substrate;
• forming openings to expose micro lens, contact pads of said dice and substrate;
• forming at least one conductive built up layer over said dielectric layer;
• forming a contacting structure over said at least one conductive built up layer;
• forming a protection layer over said at least one conductive built up layer;
• exposing said micro lens area.