US 2008/0157310 A1 · POWER DEVICE PACKAGE

Abstract

A power device package according to the one embodiment of the present invention includes an insulating substrate with an interconnection pattern disposed on the insulating substrate. The interconnection pattern comprises a single conductive layer comprising a first metal layer, and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer. A plurality of wires are attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer. Contact pads on a power control semiconductor chip and a low power semiconductor chip driving the power control semiconductor chip are electrically connected to the wires.

Claims40

Dependent claims

A power device package comprising:

an insulating substrate;
an interconnection pattern disposed on the insulating substrate, the interconnection pattern comprising a single conductive layer comprising a first metal layer and a multiple conductive layer comprising another first metal layer and a second metal layer disposed on the another first metal layer;
a plurality of wires attached to an upper surface of the single conductive layer and/or an upper surface of the second metal layer of the multiple conductive layer;
and
a contact pad on a power control semiconductor chip and a contact pad on a low power semiconductor chip driving the power control semiconductor chip, each electrically connected to the wires.

2 more elements

Dependencies are inferred from the claim text.

Power device package

Life of this patent

Power device package

Life of this patent

Abstract

Claims40