Lead frame and method of manufacturing the same, and semiconductor device

A method of manufacturing a lead frame including a lead frame main body having a die pad portion having a chip mounting surface on which a semiconductor chip is mounted, a plurality of lead portions arranged to surround the die pad portion, and a frame portion for supporting the die pad portion and the lead portions, and an adhesive film provided on a surface of the lead frame main body, which opposes a surface on which the semiconductor chip is mounted, said method comprising:

• a first metal film forming step of forming a first metal film on surfaces of the lead portions, which oppose surfaces on which the adhesive film is provided;
• a second metal film forming step of forming a second metal film, whose thickness is substantially equal to a thickness of the first metal film, on the chip mounting surface of the die pad portion;
• and
• an adhesive film providing step of providing the adhesive film on the lead frame main body by pressing after the first metal film and the second metal film are formed.

A semiconductor device comprising:

• a semiconductor chip;
• a lead frame main body containing a die pad portion having a chip mounting surface on which the semiconductor chip is mounted, and lead portions arranged to surround the die pad portion;
• a first metal film provided on the lead portions;
• a first metal wire which electrically connects the first metal film and the semiconductor chip;
• a sealing resin provided on the lead frame main body to seal the semiconductor chip;
• and
• a second metal film, whose thickness is substantially equal to a thickness of the first metal film, provided on the chip mounting surface of the die pad portion.