Chip package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorGuo-Cheng Liao
Life of this patent
Estimating the term…
Abstract
A chip package structure including a circuit board, a solder mask, and a chip package is provided. The circuit board has at least one contact on its surface. The solder mask covers the circuit board and has at least one first opening for exposing the contact. The chip package is disposed on the circuit board, and includes a chip and a leadframe, which has at least one lead that is electrically connected to the chip. The lead has an insertion portion that corresponds to the contact and inserts into the first opening. A solder bump is filled into the first opening and fastened to the insertion portion, thereby the connection between the lead and the contact of the chip package structure is secured.
Claims15
A chip package structure, comprising:
- a circuit board, having at least one contact on its surface;
- a solder mask, covering the circuit board, and having at least one first opening for exposing the contact;
- and
- a chip package, disposed on the circuit board, and comprising a chip and a leadframe, wherein the leadframe comprises at least one lead electrically connected to the chip, and the lead comprises an insertion portion that corresponds to the contact, and inserts in the first opening.
Dependencies are inferred from the claim text.