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US 2008/0157302 A1Published application
Stacked-package quad flat null lead package
OwnerSeungJu Lee, Nelson Punzalan +1inventors
InventorsSeungJu Lee, Nelson Punzalan, KwanYong Chung
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Abstract
A method, apparatus, and system relating to an IC package. The method includes providing a leadframe including a die pad for receiving a die and a plurality interconnect pillars, attaching a die to the die pad, bonding the die to the leadframe, and encapsulating the die and the leadframe to form a first IC package having a top surface and an opposing bottom surface, where the interconnect pillars extend from the top surface of the first IC package to the bottom surface of the first IC package.
Claims20
A method, comprising:
- providing a leadframe including a die pad for receiving a die and a plurality of interconnect pillars;
- attaching a die to the die pad,
- bonding the die to the leadframe;
- and
- encapsulating the die and the leadframe to form a first IC package having a top surface and an opposing bottom surface, wherein the plurality of interconnect pillars extend from the top surface of the first IC package to the bottom surface of the first IC package.
2 more elements
An apparatus, comprising:
- a leadframe having a die pad for receiving a die and an interconnect pillar, wherein the die pad and the interconnect pillar are separated;
- a die adhered to the die pad;
- a bond between the die and the leadframe;
- and
- a molding compound encapsulating the die and the leadframe to form a first IC package having a top surface and an opposing bottom surface, wherein the interconnect pillar extends from the top surface of the first IC package to the bottom surface of the first IC package.
2 more elements
A system, comprising:
- a leadframe having a die pad for receiving a die and a plurality of interconnect pillars, wherein the die pad and the interconnect pillars are separated;
- a die adhered to the die pad;
- a bond between the die and the leadframe;
- a molding compound encapsulating the die and the leadframe to form a first IC package having a top surface and an opposing bottom surface, wherein the interconnect pillars extend from the top surface of the first IC package to the bottom surface of the first IC package;
- and
- a second IC package comprising a radio frequency (RF) device, wherein the second IC package is conductively connected to the first IC package at the interconnect pillars of the first IC package.
3 more elements
Dependencies are inferred from the claim text.