Leadframe package for mems microphone assembly
AssigneeSTATS ChipPAC, Ltd.
InventorsKambhampati Ramakrishna, Seng Guan Chow
Life of this patent
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Abstract
A cavity semiconductor package has a pre-molded leadframe construction. The leadframe is formed by molding around a die pad, and plural terminal lands. The leadframe has a hole for an acoustic port, such that the package can be soldered on a back side of a printed circuit board and have air access to a sensor die in the package from a front side of the printed circuit board via the acoustic port. The leadframe may also have a hollow or concave recess that defines an acoustic cavity in conjunction with the sensor die or printed circuit board.
Claims24
A cavity semiconductor package comprising:
- a leadframe having a die pad, a plurality of terminal lands, and an outer frame portion formed with a molding material about the die pad and the terminal lands and leaving portions of the die pad and terminal lands exposed on a top surface and a bottom surface of the leadframe, and an acoustic opening extending through the leadframe permitting through-air transmission of acoustic energy into the cavity semiconductor package.
A method of manufacturing a cavity semiconductor package, comprising:
- providing a die pad and a plurality of terminal lands;
- molding a material about the die pad and the terminal lands to form an outer frame portion of a leadframe having a top surface and a bottom surface and leaving portions of the die pad and terminal lands exposed on the top surface and the bottom surface of the leadframe;
- and
- providing a hole through the leadframe from the top surface to the bottom surface to serve as an acoustic opening permitting sound travel to a semiconductor die mounted on the die pad to be packaged in the cavity semiconductor package.
Dependencies are inferred from the claim text.