Microelectronic Assembly Using Chip-On-Lead (COL) and Cantilever Leads
OwnerJeffery Gail Holloway, Anthony L. Coyleinventors
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Abstract
Packaged microelectronic semiconductor devices and methods for their assembly are described. According to preferred embodiments of the invention, chip-on-lead techniques are adapted to provide chip-on-lead packages using cantilevered leads. Exemplary embodiments of the invention include methods using a temporary brace to support the cantilevered leads during chip mounting. Versatile chip package embodiments are disclosed including those in which the chip mounting pad is smaller than the chip(s) mounted thereupon, and further examples wherein the chip mounting pad is dispensed with and a chip is mounted on the cantilevered leads alone.
Claims13
A method for assembling a microelectronic semiconductor device comprising the steps of:
- providing a leadframe having a plurality of cantilevered leads extending from a periphery toward a central region;
- and
- affixing a microelectronic semiconductor chip to a plurality of the cantilevered leads in the central region of the leadframe.
A packaged microelectronic semiconductor device assembly comprising:
- a leadframe having a plurality of cantilevered leads extending from the periphery of the package toward a central region;
- and
- one or more chips affixed in the central region to a plurality of the cantilevered leads.
Dependencies are inferred from the claim text.