Stress Mitigation in Packaged Microchips

An apparatus comprising:

• a base;
• and
• a lid coupled with the base to form a package having at least one leadframe,
• the base and lid forming a plurality of exterior surfaces, the at least one leadframe forming a first contact means on a first exterior surface, the at least one leadframe forming a second contact means on a second exterior surface, the first exterior surface being orthogonal to the second exterior surface, the first contact means and second contact means being substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.

A method of forming a packaged integrated circuit, the method comprising:

• forming at least one leadframe to have a first plurality of contacts and a second plurality of contacts;
• encapsulating a portion of the at least one leadframe within a moldable material to form a base and a lid;
• securing an integrated circuit to the base after encapsulating;
• electrically connecting the integrated circuit with the a least one leadframe, the integrated circuit substantially identically electrically connecting with the first plurality of contacts and the second plurality of contacts;
• and
• connecting the base to the lid to form a premolded package having first and second orthogonal, exterior surfaces, the first plurality of contacts being on the first exterior surface, the second plurality of contacts being on the second exterior surface.

A package apparatus comprising:

• a base;
• and
• a lid coupled with the base forming a package,
• the package forming a first exterior surface and a second exterior surface, the first exterior surface forming a first contact pattern, the second exterior surface forming a second contact pattern, the first exterior surface being in a plane that intersects the plane of the second exterior surface, the first and second contact patterns being substantially electrically identical to permit the package to be either vertically or horizontally mounted to an underlying apparatus.