Methods and apparatus for multichip module packaging

A multichip module comprising:

• a plurality of substrates, each substrate having:
• a first side and a second side;
• at least one electrical component in electrical and physical contact with the second side of each substrate;
• a contact landing facility to establish electrical contact between each substrate and the contact plane for that substrate,
• wherein the contact landing facility of each substrate is in physical and electrical contact at the level of a contact plane with the first side of the immediately-adjacent substrate.

A method for creating a multichip module, the method comprising:

• providing a substrate having a first side and a second side;
• depositing a first solder paste on the first side of the substrate;
• providing at least one first electrical component in physical proximity to the first side of the substrate using the first solder paste to establish electrical connections between the substrate and the at least one first electrical component;
• heating the substrate and the first solder paste at a first temperature to melt the first solder paste and establish electrical connections between the substrate and the at least one first electrical component;
• depositing a second solder paste having a melting temperature equal to or lower than that of the first solder paste on the second side of the substrate;
• providing at least one second electrical component in physical proximity to the second side of the substrate;
• bringing the contact landing facility in physical proximity to the second side of the substrate and aligning the facility with the second side of the substrate;
• heating the substrate, the contact landing facility and the second solder paste at a second temperature equal to or less than the first temperature to melt the second solder paste and establish electrical connections between the substrate, the contact landing facility, and the at least one second electrical component.