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US 2008/0157294 A1Published application
Package level noise isolation
AssigneeIntel Corporation
InventorsXiang Yin Zeng, Jiangqi He, Guizhen Zheng
Life of this patent
Estimating the term…
Abstract
A package may comprise a substrate provided with noise absorbing material. The noise absorbing material may absorb noise from a signal path in the substrate to prevent the noise from reaching other signals or signal paths.
Claims20
A semiconductor package, comprising:
- a substrate that comprises a first signal path and a second signal path;
- and
- a first noise absorbing material provided in the substrate to absorb noise from the first signal path.
A method, comprising:
- providing a first signal path and a second signal path in a substrate;
- providing a first noise absorbing material in the substrate to isolate noise of the first signal path from the second signal path.
A system, comprising:
- a set of antennas to receive and transmit a set of signals,
- an integrated circuit coupled to the set of antennas, wherein the integrated circuit is to modulate the set of signals, and
- a substrate to support the integrated circuit, wherein the substrate comprises a noise absorbing material to isolate the set of signals from each other.
Dependencies are inferred from the claim text.