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US 2008/0157267 A1Published application
Stacked Printed Devices on a Carrier Substrate
AssigneeTexas Instruments Incorporated
InventorsMark Gerber, Wyatt Huddleston
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AssigneeTexas Instruments Incorporated
InventorsMark Gerber, Wyatt Huddleston
Estimating the term…
Disclosed herein are systems and methods for stacking passive component devices on a substrate. A conductive material is printed onto a first substrate using a fluid ejection device to form a printed passive device according to a predetermined design. The first substrate is attached to a second substrate, such as a die, to form a component for performing a predetermined function. The component may then be tested to determine whether the component formed according to the predetermined design performs the predetermined function. The design may be adjusted in response to the test to improve the performance of the component in performing the predetermined function. Multiple substrates having printed passive devices may be stacked and electrically connected to the die or other substrate in order to increase the number of devices formed on a particular area of that die or other substrate.
A method for creating a stacked passive device on a semiconductor die, the method comprising:
A device comprising:
A method for creating a stacked passive device comprising:
Dependencies are inferred from the claim text.