Semiconductor device, method of controlling the same, and method of manufacturing the same
AssigneeSpansion LLC
InventorYukio Hayakawa
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AssigneeSpansion LLC
InventorYukio Hayakawa
Estimating the term…
The present invention provides a system comprising a semiconductor device, a method of controlling the semiconductor device in the system, and a method of manufacturing the semiconductor device in the system. The semiconductor device includes: a semiconductor region located in a semiconductor layer formed on an isolating layer; an ONO film on the semiconductor region; bit lines on either side of the semiconductor region, which are located in the semiconductor layer, and are in contact with the isolating layer; a device isolating region on two different sides of the semiconductor region from the sides on which the bit lines are located, the device isolating region being in contact with the isolating layer; and a first voltage applying unit that is coupled to the semiconductor region. In this semiconductor device, the semiconductor region is surrounded by the bit lines and the device isolating region, and is electrically isolated from other semiconductor regions.
A system, including a semiconductor device, the semiconductor device comprising:
A method of manufacturing a semiconductor device, comprising:
A method of controlling a semiconductor device that has a semiconductor region, an ONO film provided on the semiconductor region, and bit lines on either side of the semiconductor region, the method comprising:
Dependencies are inferred from the claim text.