Optical sensor package
AssigneeLite-On Semiconductor Corp.
InventorsChia-Chu Cheng, Tzu-Heng Liu, Wei-Chih Hsu, Kun-Hsun Lee
Life of this patent
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Abstract
The invention provides an optical sensor package. The package comprises a circuit board, an image sensor module and a packaging cap. The image sensor module electrically connects to the circuit board; the packaging cap is mounted on the circuit board and integrally packages the image sensor module. Hereby, the new architecture of the invention is not complex and its volume is small. The cost of the package is low, and the invention has the functions of electrostatic discharge and waterproofing; besides, the packaging cap can integrally package the image sensor module and a light-emitting module.
Claims18
An optical sensor package, comprising:
- a first circuit board;
- an image sensor module mounted on the first circuit board and connecting electrically to the first circuit board;
- and
- a packaging cap mounted on the first circuit board, packaging the image sensor module.
An optical sensor package, comprising:
- a first circuit board;
- an image sensor module mounted on the first circuit board, connecting electrically to the first circuit board;
- a light-emitting module disposed on the first circuit board;
- and
- a packaging cap mounted on the first circuit board packaging both the image sensor module and the light-emitting module.
Dependencies are inferred from the claim text.