Differential pressure sensing device and fabricating method therefor

A differential pressure sensing device package, comprising:

• a carrier, which is a lead frame having a chip pad with an upper surface, a lower surface, and a through-hole, and a plurality of pins;
• at least one differential pressure sensing device, bonded to the upper surface of the chip pad and electrically coupled with the pins, having an active surface with an active region and at least one bonding pad and a back surface with a recess corresponding to the through-hole of the carrier;
• and
• a molding compound, encapsulating the chip pad and the pins of the carrier, the differential pressure sensing device, and a bonding pad area of the differential pressure sensing device, having an opening above the active region of the differential pressure sensing device to expose the active region of the differential pressure sensing device, and having a bottom opening on the lower surface of the chip pad of the carrier to expose the through-hole.

A method of fabricating the differential pressure sensing device package, which is applied to a differential pressure sensing chip set, the differential pressure sensing chip set including a differential pressure sensing device having a sacrificial layer, and a bottom of the differential pressure sensing device having a recess, comprising:

• providing a plurality of differential pressure sensing chip sets;
• providing a carrier having a surface and a plurality of through-holes;
• bonding the plurality of differential pressure sensing chip sets to the surface of the carrier, such that the recess of each differential pressure sensing chip set is corresponding to each through-hole of the carrier, and the bonding pads of the differential pressure sensing chip set is electrically coupled with the carrier;
• forming at least one molding compound to encapsulate the carrier and the differential pressure sensing chip set and expose an upper surface of the sacrificial layer and the through-hole of the carrier;
• naturally decomposing the sacrificial layer with a solvent, so as to expose the active region of the differential pressure sensing chip set;
• and
• performing a sawing process to form a plurality of the differential pressure sensing device packages.