Controlled buckling structures in semiconductor interconnects and nanomembranes for stretchable electronics

A method of tuning a property of a stretchable component of a device;

• said method comprising the steps of:
• providing said device having said stretchable component, wherein said stretchable component comprises:
• a first end;
• a second end;
• and a central region disposed between the first and second ends;
• wherein the component is supported by a substrate, wherein the first end and second end of the component are bonded to the substrate, wherein at least a portion of the central region of the component has a bent configuration;
• wherein said central portion is under a level of strain;
• and
• modulating said level of strain of said stretchable component by compressing or elongating said stretchable component, thereby tuning said property of said stretchable component of said device.

A method of making a one or more stretchable components of a device, said method comprising the steps of:

• providing an elastomeric substrate having a receiving surface, wherein said substrate is provided having a first level of strain;
• bonding said one or more device components to said receiving surface of said elastomeric substrate having said first level of strain;
• and
• applying a force to said elastomeric substrate that generates a change in the level of strain of the substrate from said first level to a second level of strain different than said first level, wherein said change in the level of strain in said substrate from said first level to said second level causes said one or more components to bend, thereby generating said one or more stretchable components each having a first end and second end that are bonded to the substrate and a central region provided in a bent configuration.

A method of making a stretchable device or device component comprising:

• a) providing a substrate having a receiving surface with one or more relief features;
• b) depositing a device component to at least partially conformally contact said receiving surface;
• c) casting a polymeric stamp against the at least partially conformally contacted substrate;
• and
• d) removing the polymeric stamp from the substrate thereby transferring the device component to said stamp;
• wherein the device component transferred to the stamp has a pattern of bond sites that bond said device component to said stamp.

A method of making a pop-up component on a stamp surface comprising:

• a) providing a component on a substrate surface;
• b) providing an elastomeric stamp having a curved geometry
• c) transferring the component from the substrate to the stamp by:
• i) applying a deforming force to the stamp to provide a substantially flat stamp surface;
• ii) contacting the strained stamp with the component on the substrate;
• iii) removing the component from the substrate by lifting the stamp in a direction that is away from the substrate, thereby transferring the component from the substrate surface to the elastomeric stamp surface;
• and
• d) removing the deforming force to relax the stamp to the curved geometry, thereby making a pop-up component.

A method of making a biaxially stretchable semiconductor membrane comprising:

• a) providing a semiconductor nanomembrane material on a substrate, wherein the thickness of the material is between about 40 nm and 600 nm;
• b) providing an elastomeric substrate;
• c) activating one surface of the elastomeric substrate;
• d) applying a biaxial strain to the elastomeric substrate thereby stretching the elastomeric substrate in two directions;
• e) contacting the activated and stretched elastomeric substrate with the semiconductor material on substrate;
• f) peeling the elastomeric substrate off the substrate supporting the semiconductor, thereby transferring the semiconductor nanomembrane to the elastomeric substrate;
• and
• g) releasing the biaxial strain on the elastomeric substrate, thereby generating a nanomembrane having a two-dimensional wavy structure.

A method for making a multilayer device structure, said method comprising the steps of:

• providing a substrate pre-patterned with one or more device components supported by a receiving surface of the substrate;
• assembling a first set of printable semiconductor elements on said substrate by contact printing said printable semiconductor elements onto said receiving surface of the substrate or one or more structures provided thereon, thereby generating a first device layer;
• providing an interlayer on said first set of printable semiconductor elements, said interlayer having a receiving surface;
• and
• assembling a second set of printable semiconductor elements on said interlayer by contact printing said printable semiconductor elements onto said receiving surface of the interlayer or one or more structures provided thereon, thereby generating a second device layer.