Integrated circuits and interconnect structure for integrated circuits

A method for providing an integrated circuit, comprising:

• providing N plane-like metal layers, where N is an integer greater than one;
• providing a first plane-like metal layer that includes M contact portions that communicate with said N plane-like metal layers, respectively, where M is an integer greater than one;
• arranging said first plane-like metal layer and said N plane-like metal layers in separate planes;
• providing a first source, a first drain, and a second source;
• arranging at least two of said first source, said first drain and said second source to communicate with at least two of said N plane-like metal layers;
• arranging a first gate between said first source and said first drain;
• arranging a second gate between said first drain and said second source;
• defining alternating first and second regions in said first drain using said first and second gates;
• and
• arranging said first and second gates farther apart in said first regions than in said second regions.