CMOS image sensor and method for manufacturing the same
AssigneeDongbu HiTek Co., Ltd.
InventorHee Sung Shim
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AssigneeDongbu HiTek Co., Ltd.
InventorHee Sung Shim
Estimating the term…
Embodiments relate to a Complementary Metal Oxide Semiconductor (CMOS) image sensor, and to a method for manufacturing the same, that improves the low-light level characteristics of the CMOS image sensor. The CMOS image sensor has a photosensor unit and a signal processing unit, and may include a semiconductor substrate having a device isolating implant area provided with a first ion implant area and a complementary second ion implant area within the first ion implant area; a device isolating layer in the signal processing unit; a photodiode in the photosensor unit; and transistors in the signal processing unit. A crystal defect zone neighboring the photodiode may be minimized using the device isolating implant area between adjacent photodiodes so that a source of dark current can be reduced and the occurrence of interface traps can be prevented, making it possible to improve the low-light level characteristics of the image sensor.
A CMOS image sensor, comprising:
A method for manufacturing a CMOS image sensor having a photosensor unit and a signal processing unit, comprising the steps of:
Dependencies are inferred from the claim text.