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US 2008/0157148 A1Published application
Image Sensor and Method for Manufacturing the Same
OwnerJae Won Haninventor
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Abstract
An image sensor and manufacturing process thereof are provided. An image sensor according to an embodiment comprises a first wafer formed with a photodiode cell without a microlens and a second wafer formed with a logic circuit part. The first wafer is stacked on the second wafer such that a connecting electrode can be used to electrically connect the photodiode cell of the first wafer to the logic circuit part of the second wafer.
Claims18
An image sensor comprising:
- a first wafer provided with a photodiode cell without a microlens;
- a second wafer provided with a logic circuit part;
- and
- a connecting electrode electrically connecting the photodiode cell to the logic circuit part, wherein the first wafer is stacked on the second wafer.
1 more element
A method for manufacturing an image sensor, comprising:
- providing a first wafer provided with a photodiode cell without a microlens;
- providing a second wafer provided with a logic circuit part;
- stacking the first wafer on the second wafer;
- and
- electrically connecting the photodiode cell to the logic circuit part.
2 more elements
Dependencies are inferred from the claim text.