Cmos device and method of manufacturing the same

Abstract

A method of manufacturing a CMOS device including: sequentially forming a first silicon oxide film and a first polysilicon film on a lower substrate; performing an ion implantation process with respect to the first polysilicon film to form a plurality of lower conductors spaced apart from one another at a predetermined interval; forming a plurality of N-type semiconductor films and P-type semiconductor films which are formed by being spaced apart from one another at a predetermined interval and are in contact with the lower conductors; forming a plurality of upper conductors electrically connected to the N-type semiconductor films and P-type semiconductor films; forming an upper substrate on the upper conductors; forming a second polysilicon film on the upper substrate; forming a device isolation film and a photodiode in the second polysilicon film; forming a gate electrode including an insulating sidewall on the second polysilicon film; forming an insulating film on an epitaxial layer with the gate electrode; forming a color filter array on the insulating film; forming a planarization layer on the color filter array; and forming a microlens on the planarization layer.

Dependencies are inferred from the claim text.