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US 2008/0157139 A1Published application
Image sensor and method of manufacturing the same
OwnerSang-Gi Leeinventor
Life of this patent
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Abstract
An image sensor including a first epitaxial layer having a first photodiode, a second epitaxial layer formed on and/or over the first epitaxial layer, the second epitaxial layer having a second photodiode and a first plug, and a third epitaxial layer formed on and/or over the second epitaxial layer, the third epitaxial layer having a third photodiode, a second plug and an isolation layer.
Claims20
An apparatus comprising:
- a first epitaxial layer having a first photodiode formed over a semiconductor substrate;
- a second epitaxial layer formed over the first epitaxial layer, the second epitaxial layer having a second photodiode and a first plug;
- and
- a third epitaxial layer formed over the second epitaxial layer, the third epitaxial layer having a third photodiode, a second plug and an isolation layer,
- wherein the third photodiode is buried in the third epitaxial layer.
2 more elements
An apparatus comprising:
- a first epitaxial layer formed over a semiconductor substrate.
- a first photodiode formed in the first epitaxial layer;
- a second epitaxial layer formed over the first epitaxial layer;
- a second photodiode formed in the second epitaxial layer;
- a first plug formed in the second epitaxial layer;
- a third epitaxial layer formed over the second epitaxial layer;
- a plurality of isolation layers formed over the third epitaxial layer for separating an isolation region and an active region;
- a plurality of second plugs formed in the third epitaxial layer adjacent to and in direct contact with a respective one of the plurality of isolation layers;
- a third photodiode formed in the third epitaxial layer;
- and
- a gate structure formed over the third epitaxial layer,
- wherein the uppermost surface of the third photodiode is exposed.
9 more elements
A method for forming an image sensor, the method comprising the steps of:
- forming a first epitaxial layer over a semiconductor substrate;
- forming a first photodiode in the first epitaxial layer;
- forming a second epitaxial layer over the first epitaxial layer and the first photodiode;
- forming a second photodiode in the second epitaxial layer;
- forming a third epitaxial layer over the second epitaxial layer and the second photodiode;
- and
- burying a third photodiode in the third epitaxial layer.
4 more elements
Dependencies are inferred from the claim text.