Low-temperature setting adhesive and anisotropically electroconductive adhesive film using the same
AssigneeSony Chemicals Corp.
InventorsMasao Saito, Osamu Takamatsu, Takayuki Matsushima
Life of this patent
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Abstract
An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured that electroconductive particles 7 are dispersed in an insulating adhesive resin 6, comprising as main components: a radical polymerizable resin component having an unsaturated double bond; a resin component having no unsaturated double bond; a phosphoric acid-containing resin component; and a radical polymerization initiator.
Claims34
A low-temperature setting adhesive, comprising as main components:
- a cured product of an epoxy acrylate represented by the following formula:
- a resin component having no unsaturated double bond;
- a bis(methacryloyloxyethyl) hydrogen phosphate;
- and
- a radical polymerization initiator,
- wherein the epoxy acrylate is present in the amount of 15-85% by weight of adhesive, the resin component having no unsaturated double bond is present in the amount of 30 to 90% by weight of the adhesive, and the bis(methacryloyloxyethyl) hydrogen phosphate is present in the amount of 0.01 to 20% by weight of the adhesive.
An anisotropically electroconductive adhesive, comprising:
- a low-temperature setting adhesive, comprising as main components:
- a cured product of a bisphenol A type epoxy acrylate having an acryloyl group at the terminal position;
- a resin component having no unsaturated double bond,
- a bis(methacryloyloxyethyl) hydrogen phosphate,
- a radical polymerization initiator;
- and
- an electroconductive particle being dispersed in said low-temperature setting adhesive,
- wherein the epoxy acrylate is present in the amount of 15-85% by weight of adhesive, the resin component having no unsaturated double bond is present in the amount of 30 to 90% by weight of the adhesive, and the bis(methacryloyloxyethyl) hydrogen phosphate is present in the amount of 0.01 to 20% by weight of the adhesive.
An insulating adhesive film, comprising:
- a peeling sheet;
- and
- a low-temperature setting adhesive, said adhesive being provided on said sheet by coating and drying, and comprising as main components:
- a cured product of a bisphenol A type epoxy acrylate having an acryloyl group at the terminal position;
- a resin component having no unsaturated double bond, a bis(methacryloyloxyethyl) hydrogen phosphate, and a radical polymerization initiator.
An anisotropically electroconductive adhesive film, comprising:
- a peeling sheet;
- a low-temperature setting adhesive provided on said sheet by coating and drying, and comprising as main components:
- a cured product of a bisphenol A type epoxy acrylate having an acryloyl group at their terminal position;
- a resin component having no unsaturated double bond, a bis(methacryloyloxyethyl) hydrogen phosphate, and a radical polymerization initiator;
- and
- an electroconductive particle dispersed in said low-temperature setting adhesive.
Dependencies are inferred from the claim text.