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AssigneeOMRON Corporation
InventorsKatsumi Ohashi, Masanobu Horino, Yasuhiro Onishi
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Provided is a solder material test method that reduces labor and time and is preferred in operation hygiene. Detected are a first intensity at a particular wave number of infrared radiation reflected from a test-sample solder material by illuminating light to the test-sample solder material and a second intensity at the particular wave number of infrared radiation reflected from a comparative-sample solder material by illuminating light to the comparative-sample solder material. Depending upon the first and second intensities detected, intensity differences and ratios are determined. Those may be absorbance differences or intensities of between an infrared radiation absorbance to test-sample solder material and an infrared radiation absorbance to comparative-sample solder material. From the intensity difference, intensity ratio, absorbance difference and absorbance ratio, the test-sample solder material is tested for deterioration degree relatively to the comparative sample.
A solder material test method including:
A solder material test method according to claim 21, wherein the test step is to determine a difference between the first intensity and the second intensity.
A solder material test method according to claim 21, wherein the test step is to determine a ratio of the first intensity and the second intensity.
A solder material test method according to claim 21, wherein the test step is to determine a first infrared ray absorbance at the particular wave number to the test-sample solder material depending upon the first intensity, and a second infrared ray absorbance at the particular wave number to the comparative-sample solder material depending upon the second intensity, thereby determining a difference between the first infrared ray absorbance and the second infrared ray absorbance.
A solder material test method according to claim 21, wherein the test step is to determine a first infrared ray absorbance at the particular wave number to the test-sample solder material depending upon the first intensity, and a second infrared ray absorbance at the particular wave number to the comparative-sample solder material depending upon the second intensity, thereby determining a ratio of the first infrared ray absorbance and the second infrared ray absorbance.
A solder material test apparatus comprising:
A solder material test apparatus according to clam 18, wherein the intensity detecting means further detects a second intensity at the particular wave number of infrared ray reflected from the comparative-sample solder material due to illumination of the light.
A solder material test method comprising:
A solder material test apparatus comprising:
Dependencies are inferred from the claim text.