Back to results
US 2008/0156852 A1Published application
Solder flux composition and process of using same
OwnerAnna M. Prakashinventor
Life of this patent
Estimating the term…
Abstract
A solder flux composition is formulated to lower contact wetting angles on bond pads, and to remain stable until the reflow temperature of the solder. A process includes contacting a bond pad with the solder flux composition and reflowing the solder bump that is in contact with the bond pad and the solder flux composition.
Claims20
A solder flux composition comprising:
- a carboxylic acid;
- a surfactant;
- a resin;
- an amine;
- a solvent;
- an organohalide;
- and
- the solution, reaction, and mixture products thereof.
5 more elements
A solder flux composition comprising:
- a carboxylic acid;
- a surfactant;
- a resin;
- an amine;
- a solvent;
- mono-tert-butyl succinate;
- and
- the solution, reaction, and mixture products thereof.
5 more elements
A solder flux composition comprising:
- a tartaric acid;
- an amine;
- a solvent;
- a resin;
- an organohalide;
- and
- the solution, reaction, and mixture products thereof.
4 more elements
A process comprising:
- contacting a bond pad with a solder flux composition;
- and
- reflowing a solder ball in contact with the solder flux composition and the bond pad;
- wherein the solder flux composition includes one of:
- a carboxylic acid;
- a surfactant;
- a resin;
- an amine;
- a solvent;
- an organohalide;
- and the solution, reaction, and mixture products thereof, or
- a carboxylic acid;
- a surfactant;
- a resin;
- an amine;
- a solvent;
- mono-tert-butyl succinate;
- and the solution, reaction, and mixture products thereof;
- or
- tartaric acid;
- an amine;
- a solvent;
- a resin;
- an organohalide;
- and the solution, reaction, and mixture products thereof.
22 more elements
Dependencies are inferred from the claim text.