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US 2008/0156851 A1Published application
Flux spray atomization and splash control
AssigneeIntel Corporation
InventorsHarikrishnan Ramanan, Sabina Houle, Nitin Deshpande, Michael Colella, Nagaratnam Murugaiah
Life of this patent
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Abstract
Methods and apparatus to improve flux spray atomization and/or splash control are described. In one embodiment, a flux nozzle includes a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate (such as a printed circuit board). The flux fluid may atomize prior to deposition onto the substrate as relatively smaller broken down flux droplets that may aid reduced spray splash. Other embodiments are also described.
Claims15
An apparatus comprising:
- a flux nozzle having a plurality of injection holes to deposit flux fluid through an exit hole of an air cap onto a substrate,
- wherein the flux nozzle has a conical shape and one or more of the plurality of injection holes are located along a circumference of the flux nozzle.
A method comprising:
- providing a flux nozzle having a plurality of injection holes, wherein the flux nozzle has a conical shape and one or more of the plurality of injection holes are located along a circumference of the flux nozzle,
- wherein the plurality of injection holes are to deposit the flux fluid onto a substrate.
Dependencies are inferred from the claim text.