Mold shave apparatus and injection molded soldering process
AssigneeInternational Business Machines Corporation
InventorsEric E. Bouchard, Guy Brouillette, David H. Danovitch, Peter A. Gruber, Jean-Luc Landreville
Life of this patent
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Abstract
An apparatus and a method for the removal of excess solder or contaminant, which are encountered on the surfaces of injection mold prior to the transfer of a solder on a silicon wafer. More particularly, there is provided for the removal of excess solder, which may be present on a mold surface, without removing any solder, which is located in cavities formed in the mold, and wherein the solder is applied through an injection molded soldering process.
Claims12
An apparatus for shaving excess solder from the surface of a mold plate containing a multiplicity of cavities each filled with a volume of solder, said apparatus comprising:
- a support member mounting a table for movement in x-y directions;
- a vacuum table on said movable table for retaining thereon a mold plate having a multiplicity of cavities formed in an upper surface thereof for filling with solder material;
- a bridge-shaped frame mounted on said support member extending over said mold plate in spaced relationship therewith;
- a heating device pivotably mounted on said frame and having a heatable shaving blade attached to a lower end of said device for displacement across the surface of said mold plate;
- and
- a cylinder movable in a z-direction connected to, respectively, said bridge-shaped frame and to a structure having a rotary plate attached thereto for imparting rotational movement to said shaving blade, whereby said shaving blade is contactingly movable across the surface of said mold plate for scraping excess solder therefrom.
A method of shaving excess solder from the surface of a mold plate containing a multiplicity of cavities each filled with a volume of solder, said method comprising:
- providing a support member mounting a table for movement in x-y directions;
- arranging a vacuum table on said movable table for retaining thereon a mold plate having a multiplicity of cavities formed in an upper surface thereof for filling with solder material;
- mounting a bridge-shaped frame to extend over said support member and over said mold plate in spaced relationship therewith;
- pivotably mounting a heating device on said frame, and attaching a heatable shaving blade to a lower end of said device for displacement across the surface of said mold plate;
- and
- connecting a cylinder which is movable in a z-direction to, respectively, said bridge-shaped frame and to a structure which has a rotary plate attached thereto for imparting rotational movement to said shaving blade, whereby said shaving blade is contactingly movable across the surface of said mold plate for scraping excess solder therefrom.
Dependencies are inferred from the claim text.