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US 2008/0156774 A1Published application
CMP method for gold-containing substrates
AssigneeCabot Microelectronics Corporation
InventorsVlasta Brusic, Renjie Zhou, Christopher Thompson
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Abstract
The invention provides a method of chemically-mechanically polishing a gold-containing surface of a substrate with a cyanide-free chemical-mechanical polishing (CMP) composition.
Claims11
A method for polishing a gold substrate comprising:
- (a) contacting a gold-containing surface of a substrate with a polishing pad and a cyanide-free CMP composition for a time period sufficient to oxidize gold on the surface of the substrate, the CMP composition comprising an abrasive, a gold-oxidizing agent, a cyanide-free gold-solubilizing agent, and an aqueous carrier;
- and
- (b) causing relative motion between the pad and the surface while maintaining a portion of the CMP composition in contact with the surface between the pad and the substrate for a time period sufficient to abrade the oxidized portion of the surface with the CMP composition.
A method for polishing a gold substrate comprising:
- (a) contacting a gold-containing surface of a substrate with a polishing pad and a cyanide-free CMP composition for a time period sufficient to oxidize gold on the surface of the substrate, the CMP composition comprising an abrasive, an oxyhalogen compound, a halide salt, and an aqueous carrier;
- and
- (b) causing relative motion between the pad and the surface while maintaining a portion of the CMP composition in contact with the surface between the pad and the substrate for a time period sufficient to abrade the oxidized portion of the surface with the CMP composition,
- wherein the oxyhalogen compound and the halide salt are kept separate from one another and are admixed just prior to contacting the surface of the substrate, or are admixed on the surface of the substrate.
1 more element
Dependencies are inferred from the claim text.