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US 2008/0156657 A1Published application
Conductive polishing article for electrochemical mechanical polishing
OwnerPaul D. Butterfield, Liang-Yuh Chen +6inventors
InventorsPaul D. Butterfield, Liang-Yuh Chen, Yongqi Hu, Antoine P. Manens, Rashid Mavliev, Stan D. Tsai, Feng Q. Liu, Ralph Wadensweiler
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Abstract
Embodiments of a ball assembly are provided. In one embodiment, a ball assembly includes a housing, a ball, a conductive adapter and a contact element. The housing has an annular seat extending into a first end of an interior passage. The conductive adapter is coupled to a second end of the housing. The contact element electrically couples the adapter and the ball with is retained in the housing between seat and the adapter.
Claims20
An electrochemical mechanical polishing method comprising:
- providing relative motion between a substrate and a pad assembly, the substrate in contact with the pad assembly, the pad assembly supported on a platen and having a counter electrode;
- electrically biasing the substrate relative to the counter electrode while in contact with the pad assembly to process the substrate, the substrate biased through an electrical contact coupled to the platen;
- repeating the providing relative motion and the electrically biasing to process a first plurality of substrates;
- replacing one or more of the pad assembly and the electrical contact after the repeating;
- and
- processing a second plurality of substrates after one or more of the pad assembly or electrical contact has been replaced.
3 more elements
Dependencies are inferred from the claim text.