Electrode chemical control system and method

Abstract

A method and system for controlling an electroless deposition process are provided. The system generally includes an electroless plating cell having a work piece to be plated positioned therein, the work piece also being positioned in communication with an electroless plating solution contained by the plating cell, and a voltage measurement device in communication with the work piece and the electroless plating solution, the voltage measurement device being configured to measure the electrical potential difference between the work piece and the plating solution. The system further includes a control voltage device in communication with the work piece and being configured to apply a determined control voltage to the work piece, and a system controller in communication with the voltage measurement device and the control voltage device, the system controller being configured to receive an input from the voltage measurement device and to generate a control voltage output corresponding to the determined control voltage, the output being sent to the control voltage device to cause the control voltage device to apply the determined control voltage to the work piece.

Dependencies are inferred from the claim text.