Micro switch device and manufacturing method

A micro switch device comprising:

• a switch substrate having an input terminal, an output terminal, a first driving electrode, and a second driving electrode;
• a dome shaped electrostatic cover physically separated from the switch substrate, comprising a first insulation layer which faces the first driving electrode and an conductive layer formed on the first insulation layer to be electrically connected to the second driving electrode, wherein a connection electrode is formed on a bottom of the first insulation layer between the input terminal and the output terminal to electrically connect the input terminal and the output terminal;
• and
• a bezel circumferentially formed along the electrostatic cover, and spaced apart a predetermined distance from a circumference of the electrostatic cover.

A micro switch device comprising:

• a switch substrate having an input terminal, an output terminal, a first driving electrode, and a second driving electrode;
• an electrostatic cover formed substantially in a dome shape to be physically separated from the switch substrate, and comprising a first insulation layer which faces the first driving electrode and a conductive layer formed on the first insulation layer to be electrically connected to the second driving electrode, wherein a connection electrode is formed on a bottom of the first insulation layer between the input terminal and the output terminal to electrically connect the input terminal and the output terminal;
• and
• a bezel circumferentially formed along the electrostatic cover, and spaced apart a predetermined space from a circumference of the electrostatic cover;
• and
• an electrode bridge electrically connecting either the input terminal or the output terminal to the connection electrode.

A micro switch device manufacturing method comprising:

• forming an input terminal, an output terminal, a first driving electrode, and a second driving electrode;
• forming a first sacrificial layer on a switch substrate;
• forming an electrostatic cover which has a connection electrode on the switch substrate on which the first sacrificial layer is formed;
• forming a second sacrificial layer on the electrostatic cover;
• forming a bezel in a circumference of the second sacrificial layer;
• and
• eliminating the first and second sacrificial layers.