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US 2008/0156523 A1Published application
Printed-wiring board
AssigneeKabushiki Kaisha Toshiba
InventorShinichiro SAITO
Life of this patent
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Abstract
A printed-wiring board includes: a board made of insulator; a wiring pattern to transfer an electric signal which is made of patterned metallic conductor and formed on at least one of a main surface and a rear surface of the board; and an electric power layer formed on the rear surface of the board and/or in the board. The electric power layer includes a mechanism to increase and decrease a capacitance and an inductance thereof.
Claims12
A printed-wiring board, comprising:
- a board made of insulator;
- a wiring pattern to transfer an electric signal which is made of patterned metallic conductor and formed on at least one of a main surface and a rear surface of said board;
- and
- an electric power layer formed on said rear surface of said board and/or in said board,
- wherein said electric power layer includes a mechanism to increase and decrease a capacitance and an inductance thereof.
2 more elements
Dependencies are inferred from the claim text.