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US 2008/0156522 A1Published application
Anisotropic Electrically Conductive Structure
Assignee3M Innovative Properties Company
InventorMasashi Shimada
Life of this patent
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Abstract
An anisotropic electrically conductive structure comprising: a dielectric matrix having a first surface and a second surface; a heat curable adhesive layer disposed on at least one or both of said first surface and said second surface; a plurality of passages at least extending from said first surface of said matrix to said second surface of said matrix; and electrically conductive members in said passages; wherein said dielectric matrix does not exhibit thermal fluidization at a temperature required for heat curing of said heat curable adhesive layer.
Claims7
An anisotropic electrically conductive structure comprising:
- a dielectric matrix having a first surface and a second surface;
- a heat curable adhesive layer disposed on at least one or both of said first surface and said second surface;
- a plurality of passages at least extending from said first surface of said matrix to said second surface of said matrix;
- and
- electrically conductive members in said passages;
- wherein said dielectric matrix does not exhibit thermal fluidization at a temperature required for heat curing of said heat curable adhesive layer.
3 more elements
Dependencies are inferred from the claim text.