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US 2008/0156521 A1Published application
Printed wiring board, printed circuit board, and electronic device
AssigneeKabushiki Kaisha Toshiba
InventorsJun Karasawa, Syuji Hiramoto
Life of this patent
Estimating the term…
Abstract
According to one embodiment, a printed wiring board includes a plurality of pads to which bumps are to be bonded respectively. The pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of the bumps, and the plurality of conductors define a gap therebetween, the gap being capable of receiving part of the one of the bumps.
Claims10
A printed wiring board comprising:
- a plurality of pads to which bumps are to be bonded respectively,
- wherein the pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of said bumps, and
- the plurality of conductors define a gap therebetween, the gap being capable of receiving part of the one of said bumps.
A printed circuit board comprising:
- a circuit component;
- bumps electrically connected to the circuit component;
- and
- a printed wiring board on which the circuit component is mounted, the printed wiring board including a plurality of pads to which the bumps are bonded respectively,
- wherein the pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of said bumps, and
- the plurality of conductors define a gap therebetween, the gap receiving part of the one of said bumps.
3 more elements
An electronic device comprising, a printed circuit board,
- wherein the printed circuit board includes:
- a circuit component;
- bumps electrically connected to the circuit component;
- and
- a printed wiring board on which the circuit component is mounted, the printed wiring board including a plurality of pads to which the bumps are bonded respectively,
- the pads are each formed with a plurality of conductors, the conductors are separate from each other and correspond to one of said bumps, and
- the plurality of conductors define a gap therebetween, the gap receiving part of the one of said bumps.
4 more elements
Dependencies are inferred from the claim text.