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AssigneeBothhand Enterprise Inc.
InventorsChang-Liang Lin, Chi-Lung Lee, Hui-Yuan Liang, Jiu-Yan Yan
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A complex printed circuit board structure including a flexible printed wiring board and a heat-dissipating substrate bonded with the flexible printed wiring board. Parts of surface material of the flexible printed wiring board is removed to form depressions or through holes for laying electronic elements therein. The surfaces of the electronic elements can at least partially get closer to or directly contact the heat-dissipating substrate through the depressions or through holes of the flexible printed wiring board. Therefore, the heat generated by the electronic elements can be more quickly and directly conducted to the heat-dissipating substrate and dissipated at high efficiency.
A complex printed circuit board structure comprising a flexible printed wiring board and a heat-dissipating substrate bonded with the flexible printed wiring board, electronic elements being electrically connectable with the flexible printed wiring board, parts of surface material of the flexible printed wiring board being removed to form at least one depression for laying the electronic elements therein.
Dependencies are inferred from the claim text.