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US 2008/0156519 A1Published application
Printed circuit boardc structure
AssigneeBothhand Enterprise Inc.
InventorsChang-Liang Lin, Chi-Lung Lee, Hui-Yuan Liang, Jiu-Yan Yan
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Abstract
A printed circuit board structure including a carrier face on which a conductive layer is for connecting with electronic elements and a heat pipe texture arranged inside and along the printed circuit board structure. The printed circuit board is made of a material with good thermal conductivity, whereby the heat generated by the electronic elements can be quickly conducted to the heat pipe texture and quickly dissipated.
Claims38
A printed circuit board structure comprising:
- a carrier face on which a conductive layer is for connecting with electronic elements;
- and
- a heat pipe texture composed of at least one heat pipe arranged inside and along the printed circuit board structure.
Dependencies are inferred from the claim text.