Alignment and cutting of microelectronic substrates
AssigneeTessera, Inc.
InventorsKenneth Allen Honer, Christopher Paul Wade, Seiichi Tobe, Chung-Chuan Tseng, Ellis Chau, Kyong-Mo Bang
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Abstract
A substrate including plural microelectronic device carriers has metallic alignment elements. The alignment elements desirably are disposed in a predetermined positional relationship to terminals on the carriers. The alignment elements are engaged with a carrier frame and a cutting device is aligned with the carrier frame. The cutting device cuts the carriers so that borders of the carriers are in a precise relationship with the terminals.
Claims19
A method of cutting a substrate into individual microelectronic device carriers, comprising the steps of:
- inserting a substrate including a plurality of device carriers into a carrier frame by mechanically engaging one or more metallic alignment elements on the substrate with the carrier frame;
- aligning a cutting device with the carrier frame;
- and
- cutting the substrate into the individual device carriers using the cutting device.
An in-process element for holding microelectronic devices comprising:
- a substrate having an upper and lower surface and having a first area adapted to receive a plurality of microelectronic devices and a second area adapted for engagement with a carrier frame;
- metallic electrically conductive features in the first area of the substrate area configured for connection to microelectronic devices;
- and
- metallic alignment elements in the second area of the substrate, said metallic alignment elements being configured to mechanically engage into a carrier frame,
- wherein are in predetermined positional relationship with the metallic conductive features.
Dependencies are inferred from the claim text.